Counterfeit components are a $75 billion problem that kills products and reputations. Our four-stage inspection protocol catches what others miss.
An estimated 1 in 10 components in the independent distribution channel is counterfeit. Common fakes include: re-marked date codes, blacktopped packages, salvaged die in new packages, and cloned ICs with non-functional silicon. Every component we ship passes all four stages below — no exceptions.
Adapted from IDEA-STD-1010 and AS6081. Every component passes through all four gates before being cleared for shipment.
Stereo microscope examination at 40x–200x magnification. We check for: marking consistency, indentation depth, pin-1 indicators, mold marks, lead finish uniformity, body scratches or sanding marks, and package warpage.
EQUIP: Leica S9i Stereo Microscope w/ 20MP CameraX-ray fluorescence spectroscopy verifies RoHS compliance and material composition. We measure lead (Pb), cadmium (Cd), mercury (Hg), and bromine (Br) content. Terminal plating material is cross-checked against manufacturer specifications.
EQUIP: Thermo Fisher Niton XL5 XRF AnalyzerReal-time 2D X-ray reveals internal structure: die size and orientation, bond wire count and routing, lead frame geometry, and voiding in solder joints. Every image is compared against our reference library of 50,000+ known-genuine samples.
EQUIP: Nordson DAGE XD7600NT X-ray SystemChemical decapsulation (HNO₃ / H₂SO₄ at controlled temperature) exposes the silicon die. Die markings are photographed and compared to manufacturer records. Curve tracer verifies electrical parameters against datasheet specs.
EQUIP: Nisene JetEtch Pro + Tektronix 371B Curve TracerDetailed inspection criteria per component type. Sampling follows AS6081 AQL levels.
| Inspection Point | Method | ICs | Passives | Connectors | Discretes |
|---|---|---|---|---|---|
| Marking Permanency | Solvent Rub Test (IPA/Acetone) | ✓ | — | — | ✓ |
| Pin-1 / Polarity Indicator | Visual 40x | ✓ | ✓ | ✓ | ✓ |
| Lead Finish / Solderability | Visual + Dip Test | ✓ | ✓ | ✓ | ✓ |
| Body Dimensions | Digital Caliper / Shadowgraph | ✓ | ✓ | ✓ | ✓ |
| RoHS Compliance | XRF Spectroscopy | ✓ | ✓ | ✓ | ✓ |
| Internal Die / Wire Bonds | X-Ray Imaging | ✓ | — | — | ✓ |
| Die Markings | Chemical Decapsulation | ✓ | — | — | ✓ |
| Electrical Parameters | Curve Tracer / LCR Meter | ✓ | ✓ | — | ✓ |
| Counterfeit DB Check | ERAI / GIDEP Search | ✓ | ✓ | ✓ | ✓ |
Our QC lab operates to internationally recognized standards for electronic component inspection.
We do not buy from unknown vendors. Every source is vetted before the first order.
Direct from manufacturer-authorized distributors with full traceability certificates. Preferred sourcing route for all active-production parts.
For EOL and allocation parts: independent distributors who pass our supplier audit. Minimum 3 successful transactions before full qualification.
We never buy from brokers who cannot provide documented provenance. If a vendor can't trace a part back to the manufacturer or a known OCM, we walk away.
Every shipment includes: Certificate of Conformance, date/lot codes, country of origin, RoHS/REACH declarations, and QC inspection report.
Confirmed counterfeit incidents across 500M+ components delivered. Not luck — process.
Upload your BOM. Every line item gets the full four-stage treatment before it reaches your dock.